By hmimcu Chen Fang, deputy director of TSMC (China) Co., Ltd., said at the 2022 World Semiconductor Conference that the N3 chip will be mass-produced in the second half of this year and has been delivered to some mobile and HPC (high-performance computing) customers. The current use of 3nm chips, products will be available next year.
It has been reported that the “Business Times” said that after the completion of technology research and development and trial production of TSMC’s 3nm (N3) process, it is expected that the film production volume will start to increase significantly in the second half of the third quarter, and the monthly film production volume in the fourth quarter will reach the level of thousands of pieces. Enter the mass production stage. display hmi lcd
Semiconductor equipment manufacturers pointed out that judging from the trial production of TSMC’s N3 process, it is expected that after entering mass production in September, the initial yield performance will be better than the initial stage of the previous 5nm (N5) process.
Wei Zhejia, president and co-CEO of TSMC, also said before that TSMC’s N3 process progress is in line with expectations, and it will be mass-produced in the second half of 2022 with a good yield rate. Driven by HPC (High Performance Computer Cluster) and smartphone-related applications, the N3 process will be mass-produced steadily in 2023, and will begin to contribute to revenue in the first half of 2023.
At the same time, the N3E (3nm enhanced version) process will be used as an extension of TSMC’s 3nm family, and its R&D results are also better than expected, with better performance, power consumption and yield, which will provide smartphones and HPC-related applications in the 3nm process era. Complete support platform. The N3E process will enter mass production in the second half of 2023, and Apple and Intel will be the two major customers.
According to reports, TSMC’s 3nm still uses the Fin Field Effect Transistor (FinFET) architecture, but the N3 process has adopted the innovative TSMC FINFLEX technology to further improve the PPA (performance, power efficiency and density) of the 3nm family technology.
At the same time, TSMC also stated at the 2022 technical seminar that when the 3nm process technology is launched, it will be the most advanced technology in the industry in terms of PPA and transistor technology. It is confident that the 3nm family will become another large-scale and long-term demand for TSMC. process node.